Hirokazu Sasaki, Hideo Nishikubo, Shinsuke Nishida, Satoshi Yamazaki, Ryusuke Nakasaki, Takemi Isomatsu,
Ryuichiro Minato, Kohei Kinugawa, Akihiro Imamura, Shinya Otomo, Yujin Hori, Kiyoshige Hirose, Satoshi Anada,
Kazuo Yamamoto, Tsukasa Hirayama, Jun Yamasaki, Naoya Shibata, Yojiro Oba, Masato Ohnuma
Several cases using advanced analysis technology including electron microscope, synchrotron radiation, and surface analysis for various new materials/ products are introduced. Electron holography and the Differential Phase Contrast-Scanning Transmission Electron Microscopy (DPC-STEM) were used for the analysis of a semiconductor laser diode for optical communication. 3D analysis with Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM) was utilized for analyzing winding wire with a micro cellular coating. The Small Angle X-ray Scattering (SAXS) method was used at Super Photon-ring-8-GeV (SPring-8) for analyzing a coated superconductor tape and a copper alloy. The surface analysis method of Hard X-ray Photoelectron Spectroscopy (HAXPES) was utilized for analyzing the AuSn solder.
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