Shingo Kawata
Abstract
Cu-Mn-Ni resistance alloys are important metallic materials which support recent advances in electronics and energy management. In this study, the effects of the addition of Mn and Ni in Cu-Mn-Ni alloys and the impact of the microstructure of metals on the change in resistivity with temperature were investigated. There was a strong positive correlation between the resistivity and the Mn content. We confirmed that in addition to reducing the content of Mn and increasing the content of Ni, coarsening the grain size is effective in reducing the change in resistivity with temperature from 0°C to 150°C. We believe that resistance materials with optimized elements and microstructures will make further contributions to the evolution of electronics in the future.
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